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Equipment performance

This machine is designed for cutting the wafer in solar industry and electronic industry specially.

SYC50 adopts YAG Kr pump laser and acousto-optical modulating system, digital control X / Y worktable, step motor for driving, moving

precisely under the control of computer, the professional control software can make the edit and revision of program more simply and show

the motion track gradually.

SYC100 adopts the YAG Xe-pump laser for impulse, it has the characters of low repeating frequency, narrow width of pulse, higher

density of energy. The digital control X-Y worktable can finish any track of motion under the accurate control of computer, and it is

designed for cutting the thick wafer specially.

Applicable fields

   The SYC50 laser cutting machine is very suitable for cutting the wafer spall of sillicon rod.

   The SYC100 laser cutting machine is very suitable for cutting the wafer of electronic industry.

The main technical parameters

Type specification

SYC50 / SYC100

Laser wavelength

1.064¥ìm

Scriber precision

¡Â¡¾10¥ìm

Max scriber thickness

0.8mm

Scriber line width

¡Â80¥ìm

Laser repetition frequency

100Hz~20kHz

Max scriber speed

20mm/s

Laser max power

¡Ã50W          ¡Ã100W

Work platform size

280¡¿500mm     300¡¿300mm

Power supply

380V / 50Hz / 6kVA

Cooling way

Circulation water cooling

Work platform

Made professionally


Showroom for samples

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